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EzPCB Capabilities
Item |
Technical Parameter |
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Layers |
1-40 Layers |
Materials |
FR-4, FR-1, CEM-1, CEM-3, Teflon, Rogers |
Max. Board Size |
550mm X 710mm |
Board Thickness |
0.15mm-5mm |
The Min. Track |
3mil (0.075mm) |
The Min. Clearance |
3mil (0.075mm) |
The Min. Diameter |
0.10mm |
Hole Plating Thickness |
>=0.025mm |
PTH Hole Dia. Tolerance |
<= 0.8 |
0.03mm |
< 0.8 |
0.03mm |
Hole Postion Deviation |
0.03mm |
Outline Tolerance |
0.10mm |
Insulation Resistance |
>= 10000000 KOhm |
Through Hole Resistance |
<=300uOhm |
Dielectric Strength |
>=1.6KV/mm |
Current Breakdown |
10A |
Peel-off Strength |
1.5N/mm |
| Solder Mask Abrasion |
>5H |
| Thermal Stress |
288 C 10sec |
| Inflammability |
94V0 |
| E-Test Voltage |
10-250V |
| Pull of Strength of Peels |
>100N |
| Sloder Ability |
235 C |
| Bow and Twist |
<0.01mm/mm |
| Color |
Green, Red, Blue, Black, Yellow |
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