Item

Technical Parameter

Layers

1-30 Layers

Materials

FR-4, FR-1, CEM-1, CEM-3, Teflon, Rogers

Max. Board Size

550mm X 710mm

Board Thickness

0.15mm-5mm

The Min. Track

3mil (0.075mm)

The Min. Clearance

3mil (0.075mm)

The Min. Diameter

0.10mm

Hole Plating Thickness

>=0.025mm

PTH Hole Dia. Tolerance

<= 0.8

0.03mm

< 0.8

0.03mm

Hole Postion Deviation

0.03mm

Outline Tolerance

0.10mm

Insulation Resistance

>= 10000000 KOhm

Through Hole Resistance

<=300uOhm

Dielectric Strength

>=1.6KV/mm

Current Breakdown

10A

Peel-off Strength

1.5N/mm

Solder Mask Abrasion

>5H

Thermal Stress

288 C 10sec

Inflammability

94V0

E-Test Voltage

10-250V

Pull of Strength of Peels

>100N

Sloder Ability

235 C

Bow and Twist

<0.01mm/mm

Color

Green, Red, Blue, Black, Yellow