| PCB Capabilities | |
| Layer Counts | 1-40 |
| Thickness | Max:6.0MM Min:0.4MM |
| Max Board Size | 680x1000MM |
| Max Depth/Diameter Ratio | 12:01 |
| Min Hole Size | 4MIL |
| Max Paste Thickness | 0.4-1MIL |
| Solder Mask Thickness | 0.4-1MIL |
| Min Mask Bridge | 4MIL |
| Impedance Control Tolerance | ±10% |
| V-cut Angle | 30°/45°/60° |
| Size Tolerance | ±0.13mm |
| PTH Tolerance | ±0.05mm |
| NPTH Tlerance | ±0.05mm |
| Hole Position Tolerance | ±0.076mm |
| Inner layer Trace Width/Spance | 0.5OZ:3mil/3mil |
| 1OZ:4mil/4mil | |
| Out layer Trace Width/Spance | 1OZ:4mil/4mil |
| Bent | ≤0.7% |
| Tear Off Strength | 1.4N/mm |
| Solder Mask Hardhess | >5H |
| Thermal Shock | 260°C 20(s）second |
| Resistance | 1E+12ΩNormal |
| Testing Voltage | 50-250V |
| Surface Finish | HASL |
| Lead free HAL | |
| OSP | |
| Flash gold | |
| Immersion gold | |
| Immersion silver | |
| Immersion tin | |
| Gold finger plating | |
| Materials | FR4 |
| Aluminum base | |
| PTFE | |
| Halogen free | |
| Isola | |
| Standard | IPC-A-600G/MIL-STD-105D |
Scoring
