PCB Capabilities | |
Layer Counts | 1-40 |
Thickness | Max:6.0MM Min:0.4MM |
Max Board Size | 680x1000MM |
Max Depth/Diameter Ratio | 12:01 |
Min Hole Size | 4MIL |
Max Paste Thickness | 0.4-1MIL |
Solder Mask Thickness | 0.4-1MIL |
Min Mask Bridge | 4MIL |
Impedance Control Tolerance | ±10% |
V-cut Angle | 30°/45°/60° |
Size Tolerance | ±0.13mm |
PTH Tolerance | ±0.05mm |
NPTH Tlerance | ±0.05mm |
Hole Position Tolerance | ±0.076mm |
Inner layer Trace Width/Spance | 0.5OZ:3mil/3mil |
1OZ:4mil/4mil | |
Out layer Trace Width/Spance | 1OZ:4mil/4mil |
Bent | ≤0.7% |
Tear Off Strength | 1.4N/mm |
Solder Mask Hardhess | >5H |
Thermal Shock | 260°C 20(s)second |
Resistance | 1E+12ΩNormal |
Testing Voltage | 50-250V |
Surface Finish | HASL |
Lead free HAL | |
OSP | |
Flash gold | |
Immersion gold | |
Immersion silver | |
Immersion tin | |
Gold finger plating | |
Materials | FR4 |
Aluminum base | |
PTFE | |
Halogen free | |
Isola | |
Standard | IPC-A-600G/MIL-STD-105D |